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 STFW3N150 STP3N150, STW3N150
N-channel 1500 V, 6 , 2.5 A, PowerMESHTM Power MOSFET in TO-220, TO-247, TO-3PF
Features
Type STFW3N150 STP3N150 STW3N150

VDSS 1500 V 1500 V 1500 V
RDS(on) max. <9 <9 <9
ID
PTOT
3 1 2
2.5 A 63 W 2.5 A 140 W 2.5 A 140 W
TO-220
100% avalanche tested Intrinsic capacitances and Qg minimized High speed switching Fully isolated TO-3PF plastic package Creepage distance path is 5.4 mm (typ.) for TO-3PF Figure 1. Internal schematic diagram
TO-247
2 1 3
1 2 3
TO-3PF
Application
Switching applications
Description
Using the well consolidated high voltage MESH OVERLAYTM process, STMicroelectronics has designed an advanced family of very high voltage Power MOSFETs with outstanding performances. The strengthened layout coupled with the company's proprietary edge termination structure, gives the lowest RDS(on) per area, unrivalled gate charge and switching characteristics.
Table 1.
Device summary
Marking 3N150 3N150 3N150 Package TO-3PF TO-220 TO-247 Packaging Tube Tube Tube
Order codes STFW3N150 STP3N150 STW3N150
June 2010
Doc ID 13102 Rev 9
1/15
www.st.com 15
www.DataSheet.in
Contents
STFW3N150, STP3N150, STW3N150
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................ 6
3 4 5
Test circuits
.............................................. 9
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
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STFW3N150, STP3N150, STW3N150
Electrical ratings
1
Electrical ratings
Table 2.
Symbol VDS VGS ID ID IDM
(1)
Absolute maximum ratings
Value Parameter TO-220,TO-247 Drain-source voltage (VGS = 0) Gate-source voltage Drain current (continuous) at TC = 25 C Drain current (continuous) at TC = 100 C Drain current (pulsed) Total dissipation at TC = 25 C Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1 s;TC=25 C) Derating factor 1.12 -50 to 150 150 2.5 1.6 10 140 1500 30 2.5(1) 1.6 10
(1) (1)
Unit TO-3PF V V A A A W V W/C C C
PTOT VISO
63 3500 0.5
Tstg Tj
Storage temperature Max. operating junction temperature
1. Pulse width limited by safe operating area
Table 3.
Symbol Rthj-case Rthj-amb Tj
Thermal data
Parameter Thermal resistance junction-case max Thermal resistance junction-ambient max Maximum lead temperature for soldering purpose 62.5 TO-220 TO-247 TO-3PF 2 50 300 50 Unit C/W C/W C
0.89
Table 4.
Symbol IAR EAS
Avalanche characteristics
Parameter Avalanche current, repetitive or not-repetitive (pulse width limited by Tj max) Single pulse avalanche energy (starting Tj = 25 C, ID = IAR, VDD = 50 V) Max value 2.5 450 Unit A mJ
Doc ID 13102 Rev 9
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Electrical characteristics
STFW3N150, STP3N150, STW3N150
2
Electrical characteristics
(Tcase = 25 C unless otherwise specified) Table 5.
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on
On /off states
Parameter Drain-source breakdown voltage Test conditions ID = 1 mA, VGS = 0 Min. 1500 10 500 100 3 4 6 5 9 Typ. Max. Unit V A A nA V
VDS = Max rating Zero gate voltage drain current (VGS = 0) VDS = Max rating, TC=125 C Gate-body leakage current (VDS = 0) VGS = 30 V
Gate threshold voltage VDS = VGS, ID = 250 A Static drain-source on resistance VGS = 10 V, ID = 1.3 A
Table 6.
Symbol gfs (1) Ciss Coss Crss
Dynamic
Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Test conditions VDS = 30 V, ID = 1.3 A Min. Typ. 2.6 939 102 13.2 100 Max. Unit S pF pF pF pF
VDS = 25 V, f = 1 MHz, VGS = 0
-
-
Coss eq. (2) Equivalent output capacitance Rg Qg Qgs Qgd Gate input resistance Total gate charge Gate-source charge Gate-drain charge
VDS=0 to 1200 V, VGS = 0 f=1 MHz Gate DC Bias=0 Test signal level=20 mV open drain VDD = 1200 V, ID = 2.5 A, VGS = 10 V (see Figure 19)
-
-
-
4 29.3 4.6 17
-
nC nC nC
-
-
1. Pulsed: Pulse duration = 300 s, duty cycle 1.5% 2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS
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STFW3N150, STP3N150, STW3N150
Electrical characteristics
Table 7.
Symbol td(on) tr td(off) tf
Switching times
Parameter Turn-on delay time Rise time Turn-off-delay time Fall time Test conditions VDD = 750 V, ID = 1.25 A, RG = 4.7 , VGS = 10 V (see Figure 18) Min. Typ. 24 47 45 61 Max. Unit ns ns ns ns
-
-
Table 8.
Symbol ISD ISDM
(1)
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 2.5 A, VGS = 0 ISD = 2.5 A, di/dt = 100 A/s VDD= 60 V (see Figure 20) ISD = 2.5 A, di/dt = 100 A/s VDD= 60 V, Tj = 150 C (see Figure 20) Test conditions Min. Typ. Max. Unit 410 2.4 11.7 540 3.3 12.3 2.5 10 1.6 A A V ns C A ns C A
VSD (2) trr Qrr IRRM trr Qrr IRRM
-
1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300 s, duty cycle 1.5%
Doc ID 13102 Rev 9
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Electrical characteristics
STFW3N150, STP3N150, STW3N150
2.1
Figure 2.
ID (A)
Electrical characteristics (curves)
Safe operating area for TO-3PF
AM03934v1
Figure 3.
K
Thermal impedance for TO-3PF
TO3PF
=0.5 0.2 0.1
)
10
is
Op Lim era ite tion d by in th m is ax ar R ea
10s 100s 1ms
(o n
DS
1
10
-1
0.05 0.02 0.01 Single pulse
0.1
Tj=150C Tc=25C Sinlge pulse
10ms
0.01 0.1
1
10
100
1000
VDS(V)
10 -5 10
-2
10
-4
10
-3
10
-2
10
-1
tp (s)
Figure 4.
Safe operating area for TO-220
Figure 5.
Thermal impedance for TO-220
Figure 6.
Safe operating area for TO-247
Figure 7.
Thermal impedance for TO-247
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STFW3N150, STP3N150, STW3N150 Figure 8. Output characteristics Figure 9.
Electrical characteristics Transfer characteristics
Figure 10. Normalized BVDSS vs. temperature Figure 11. Static drain-source on resistance
Figure 12. Gate charge vs. gate-source voltage
Figure 13. Capacitance variations
Doc ID 13102 Rev 9
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Electrical characteristics Figure 14. Normalized gate threshold voltage vs. temperature
STFW3N150, STP3N150, STW3N150 Figure 15. Normalized on resistance vs. temperature
Figure 16. Source-drain diode forward characteristics
Figure 17. Maximum avalanche energy vs Tj
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STFW3N150, STP3N150, STW3N150
Test circuits
3
Test circuits
Figure 19. Gate charge test circuit
VDD 12V
2200
Figure 18. Switching times test circuit for resistive load
47k 100nF
1k
RL VGS VD RG PW D.U.T.
F
3.3 F
VDD Vi=20V=VGMAX
2200 F
IG=CONST 100 2.7k 47k PW 1k
AM01469v1
D.U.T. VG
AM01468v1
Figure 20. Test circuit for inductive load Figure 21. Unclamped inductive load test switching and diode recovery times circuit
A D G S B 25 D.U.T.
A FAST DIODE B
A L=100H B D G 3.3 F 1000 F
L
VD
2200 F
3.3 F
VDD
VDD
ID
RG
S
Vi
D.U.T.
Pw
AM01470v1 AM01471v1
Figure 22. Unclamped inductive waveform
V(BR)DSS VD
Figure 23. Switching time waveform
ton tdon tr toff tdoff tf
90% IDM
90% 10%
ID VDD VDD
0
10%
VDS 90%
VGS
AM01472v1
0
10%
AM01473v1
Doc ID 13102 Rev 9
9/15
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Package mechanical data
STFW3N150, STP3N150, STW3N150
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
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STFW3N150, STP3N150, STW3N150
Package mechanical data
TO-220 mechanical data
mm Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 P Q 4.40 0.61 1.14 0.48 15.25 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 Typ Max 4.60 0.88 1.70 0.70 15.75 Min 0.173 0.024 0.044 0.019 0.6
inch Typ Max 0.181 0.034 0.066 0.027 0.62 0.050 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 0.151 0.116
Doc ID 13102 Rev 9
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Package mechanical data
STFW3N150, STP3N150, STW3N150
TO-247 Mechanical data
mm. Min. 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 3.65 5.50 14.80 4.30 Typ Max. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75
Dim. A A1 b b1 b2 c D E e L L1 L2 oP oR S
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STFW3N150, STP3N150, STW3N150
Package mechanical data
TO-3PF mechanical data
DIM. A C D D1 E F F2 G G1 H L L2 L3 L4 L5 L6 L7 N R Dia mm. typ
min. 5.30 2.80 3.10 1.80 0.80 0.65 1.80 10.30 15.30 9.80 22.80 26.30 43.20 4.30 24.30 14.60 1.80 3.80 3.40
max. 5.70 3.20 3.50 2.20 1.10 0.95 2.20 11.50 15.70 10.20 23.20 26.70 44.40 4.70 24.70 15 2.20 4.20 3.80
5.45 10
7627132_C
Doc ID 13102 Rev 9
13/15
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Revision history
STFW3N150, STP3N150, STW3N150
5
Revision history
Table 9.
Date 12-Jan-2007 17-Apr-2007 14-May-2007 29-Aug-2007 09-Apr-2008 13-Feb-2009 01-Dec-2009 10-Dec-2009 29-Jun-2010
Document revision history
Revision 1 2 3 4 5 6 7 8 9 First release Added new value on Table 6. The document has been reformatted RDS(on) value changed, updated Figure 15 Added new package: TO-3PF Added PTOT value for TO-3PF (Table 2: Absolute maximum ratings) - Document status promoted from preliminary data to datasheet - Removed TO-220FH package and mechanical data Corrected VISO value in Table 2: Absolute maximum ratings Corrected unit in Table 3. Changes
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STFW3N150, STP3N150, STW3N150
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK.
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ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
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